Press photos of the product range of
Semiconductor Manufacturing Technology

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EUV-Technology

For Carl Zeiss SMT, EUV technology is the future of lithography optics. This technology uses extreme ultraviolet light with a wave length of 13.5 nanometers.

 

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EUV-Technology Components

The alignment of the lithography optics must be carried out with the highest precision. The optical components must be aligned with the utmost accuary.

 

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Alignment of Lithography optics

The mounting and alignment of the lithography optics takes place in the cleanroom. In order to protect the extremely sensitive optical parts, employees wear a full set of cleanroom garments.

 

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Lenses for microlithography

Lenses for microlithography, an important stage in the production of microchips, are developed and produced by Carl Zeiss SMT AG. The most recent lens generation is now laying the basis for the chips of tomorrow.

 

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File size: 556 kB
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Optics focused on the future

Mirror system for the sample of an EUV exposure system (Extreme Ultra Violet) for upcoming chip generations.

 

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File size: 673 kB
Image size: 1589 × 1181 pixels
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Room for precicion optics

Vacuum chamber of an EUV illumination system intended for future lithography systems used in semiconductor production.

 

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File size: 572 kB
Image size: 1447 × 1772 pixels
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AIMS™ 32-193i

Advanced Mask Qualification for 193 nm Lithography Techniques

 

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File size: 230 kB
Image size: 2128 × 1416 pixels
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MeRiT® HR 32

High Resolution Repair Platform

 

Type of file: JPEG
File size: 225 kB
Image size: 2128 × 1416 pixels
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PROVE®

High Resolution Photomask Registration and Overlay Metrology

 

Type of file: JPEG
File size: 337 kB
Image size: 2660 × 1770 pixels
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WLCD

Wafer Level CD Metrology

 

Type of file: JPEG
File size: 335 kB
Image size: 2660 × 1770 pixels
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CDC32

Advanced Critical Dimension Control

 

Type of file: JPEG
File size: 243 kB
Image size: 840 × 755 pixels
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RegC®

Registration and Overlay Control

 

Type of file: JPEG
File size: 467 kB
Image size: 1181 × 1282 pixels
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